Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Industry News | 2007-01-29 15:10:05.0
Palo Alto, Calif.
Industry News | 2018-09-17 19:37:42.0
MIRTEC, “The Global Leader in Inspection Technology,” announces plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will premier its award-winning MV-6 OMNI 3D AOI and MS-11e 3D SPI systems Booth #208.
Industry News | 2013-10-02 14:39:35.0
Baja Bid announced its latest event which features quality used equipment at discounted prices for the electronics manufacturing industry.
Industry News | 2023-08-12 13:48:10.0
In the SMT production process, considering the importance of the mounting speed of the SMT machine, many SMT machine manufacturers are making every effort to improve the speed of the SMT machine. KINGSUN technical team has analyzed the following main methods to improve the speed of the SMT machine:
Industry News | 2023-07-22 11:28:46.0
If need more technical support , pls contact with us at Jenny@ksunsmt.com
Industry News | 2017-05-03 14:44:35.0
SmtXtra offers cost savings on a massive range of original and replacement SMT Nozzles. The company ships worldwide within three working days of receiving the order and guarantees customer satisfaction with all products.
Industry News | 2023-03-06 17:13:47.0
IPC issues February Economic Outlook report
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2023-07-22 07:29:05.0
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