Industry News: profile for vitronics (Page 1 of 28)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Evaluation Kit for Novel Board-to-board Jumpers

Industry News | 2003-03-04 08:08:23.0

In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.

SMTnet

MIRTEC Selected as AOI Supplier of Choice for Jaltek Systems

Industry News | 2014-03-20 09:56:25.0

MIRTECannounces that Jaltek Systems, located in Bedfordshire, UK, has selected its MV-7 OMNI 2D/3D In-Line AOI Machine.

MIRTEC Corp

California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

ITW EAE Announces New Representation Agreements for MPM, Camalot and Electrovert Equipment

Industry News | 2018-02-06 20:58:27.0

ITW EAE, the Electronic Assembly Equipment division of Illinois Tool Works, is extending representation agreements for several of its existing Vitronics Soltec partners to include MPM, Camalot and Electrovert equipment. The new agreements, which will be effective February 12, 2018, will now include all ITW EAE’s electronic assembly equipment which includes MPM printers, Camalot dispensers, Electrovert soldering and cleaning equipment and Vitronics Soltec soldering equipment.

ITW EAE

Vitronics Soltec Introduces 3D-Printed Twin-Nozzle for ZEVA Point-to-Point Selective Soldering

Industry News | 2020-04-14 22:14:18.0

ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.

ITW EAE

ITW EAE Wins VA Excellence Award for the Camalot Prodigy’s Dynamic Dual Head Dispensing Technology

Industry News | 2019-05-01 20:22:28.0

ITW EAE is proud to announce that it has earned a coveted VA Excellence Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented during the 13th Vision Awards program at Nepcon China.

ITW EAE

ITW EAE Wins Global Technology Award for the Camalot Prodigy's Dynamic Dual Head Dispensing Technology

Industry News | 2020-04-14 18:17:46.0

ITW EAE has earned a coveted Global Technology Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented to Camalot Prodigy Business Manager, Hugh Reed and Engineering Manager Scott Reid during a ceremony at Productronica in Munich Germany.

ITW EAE

ITW EAE Introduces Auto Exit Wing Feature for Electrovert® Wave Soldering Machines

Industry News | 2022-11-21 15:50:26.0

ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB 'peels' away from the solder which minimizes the opportunity for bridging defects to occur.

ITW EAE

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