Industry News: program ic (Page 1 of 24)

Cadence Announces Aptivia Parallel Characterization Option

Industry News | 2003-06-02 09:14:01.0

Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x

SMTnet

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

IPC Offers First Advanced Packaging Symposium Building the IC-Substrate and Package Assembly Ecosystem

Industry News | 2022-08-08 07:10:23.0

Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.

Association Connecting Electronics Industries (IPC)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

Program Finalized for Counterfeit Electronic Parts West

Industry News | 2012-10-10 17:26:45.0

SMTA and CALCE are pleased to announce that the program is finalized for the Counterfeit Electronic Parts and Electronic Supply Chain Symposium West. The program is available on-line at www.smta.org/counterfeit and registration is open

Surface Mount Technology Association (SMTA)

Electronics Industry Calls for U.S. Presidential Determination On Key Components Under Defense Production Act

Industry News | 2022-09-26 06:35:13.0

The electronics industry is calling on U.S. President Joe Biden to address urgent industrial base vulnerabilities and deliver on the promise of the CHIPS Act by prioritizing domestic development of printed circuit boards (PCBs) and integrated circuit (IC) substrates under Title III of the Defense Production Act.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Concludes on a Positive Note

Industry News | 2009-11-06 17:10:00.0

Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the the 6th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

Additive Electronics Conference Announced

Industry News | 2019-08-21 16:21:55.0

The SMTA will organize the “Additive Electronics Conference: PCB Scale to IC Scale” on October 24, 2019 at the DoubleTree by Hilton San Jose in San Jose, California. The conference examines the manufacturing and design processes enabling line width and space from .003" to 5 microns as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices.

Surface Mount Technology Association (SMTA)

2009 SMTA Anaheim Academy Program Announced

Industry News | 2008-12-06 02:08:39.0

Anaheim, CA � The SMTA is pleased to announce the 2009 SMTA Anaheim Academy program. SMTA Anaheim will be held February 10-11, 2009 at the Anaheim Convention Center in conjunction with Electronics West. This year's program will feature six half-day Courses led by leading instructors in the industry.

Surface Mount Technology Association (SMTA)

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