Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2014-07-24 10:09:05.0
With this new Release, Viscom introduces numerous innovations and improvements in the area of inspection plan generation and analysis software for its inspection systems.
Industry News | 2013-02-21 06:57:08.0
VJ Electronix, Inc.,announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – AXI for its Vertex II next-generation X-ray technology.
Industry News | 2009-09-17 16:35:17.0
September 2009 — Littleton, Massachusetts — VJ Electronix, Inc. announces that it will exhibit its Summit 1100 rework system and Vertex 130 in booths 303 and 305 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2012-01-24 16:12:56.0
VJ Electronix will display a fully configured SRT Micra Rework Platform in Booth #3051 at the upcoming IPC APEX Expo.
Industry News | 2013-01-15 11:02:53.0
VJ Electronix, Inc. will display its new Vertex II next-generation X-ray technology and fully configured SRT Micra Rework Platform in Booth #333 at the upcoming IPC APEX Expo
Industry News | 2013-03-18 16:59:53.0
VJ Electronix, Inc., will display its new Vertex II next-generation X-ray technology and the high-performance SRT Micra Rework Platform in Stand #7-233 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2013-03-27 16:44:31.0
VJ Electronix, Inc., will display its new Vertex II next-generation X-ray technology and the high-performance SRT Micra rework platform in the Kasion Booth (1G56) at the NEPCON China 2013 exhibition and conference.
Industry News | 2013-07-29 13:46:48.0
VJ Electronix, Inc will display its new Vertex II next-generation X-ray technology and the high-performance SRT Micra rework platform in the Kasion Booth 1H43 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2018-11-14 15:34:52.0
Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.
