Industry News: pth pad to pad spacing (Page 2 of 3)

Parvus Unveils Three Fanless 800MHz Pentium III PC/104-Plus CPU Modules Designed for -40C to +85C Extended Temperature

Industry News | 2005-07-11 12:52:53.0

Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463

Parvus Corporation

Seika Machinery to Highlight All New Machines at SMTA Indiana Expo & Trade Forum 2012

Industry News | 2012-03-09 16:13:42.0

Seika Machinery will highlight its new, innovative products at the upcoming SMTA Indiana Expo & Trade Forum.

Seika Machinery, Inc.

Kurtz Ersa to Show New Innovations in the U.S. for the First Time at APEX

Industry News | 2016-02-15 20:36:38.0

Kurtz Ersa North America will exhibit in Booth #1326 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Ersa will introduce its new line of selective solder, reflow and rework equipment and more.

3M Electrical Solutions Division

Revamped and Relaunched: Download the New NEPCON App to Win Prizes

Industry News | 2015-04-09 10:31:22.0

NEPCON China 2015 will take place in Hall 1 of Shanghai World Expo Exhibition & Convention Center from 21-23 April. The show will cover the latest products and technologies in the fields of SMT, surface welding, electronic test and measurement, electronics manufacturing automation, ESD, and new materials.

Reed Exhibitions

Gartner Says Worldwide Semiconductor Market to Grow 4.6 Percent as Revenue Reaches $314 Billion in 2011

Industry News | 2010-12-10 14:49:08.0

As the semiconductor industry completes one of its most successful years in 2010, the market is positioned for continued, albeit slower, growth in 2011, according to the latest outlook by Gartner, Inc. Worldwide semiconductor revenue is forecast to total $314 billion in 2011, up 4.6 percent from 2010's estimated revenue of $300.3 billion.

Gartner, Inc.

ECT’s CPG to Highlight the ZIP® Family at Semicon China 2011

Industry News | 2011-03-07 14:43:24.0

Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in its distributor, Tronic Electronics HK Ltd.'s, Booth 2452 Hall 2 at the upcoming Semicon China Exhibition. A new eight-page ZIP® Product Portfolio brochure will be available for the first time at the ECT CPG booth. ZIP® recently has been granted US Patent Number 7,862,391.

Everett Charles Technologies

Seika Machinery to Launch New Machines at SMTA Dallas Expo & Tech Forum 2012

Industry News | 2012-01-30 13:43:45.0

Seika Machinery will highlight many new, innovative products at the upcoming SMTA Dallas Expo and Tech Forum.

Seika Machinery, Inc.

Seika Machinery to Highlight Leading Systems at SMTA Upper Midwest Expo & Trade Forum 2012

Industry News | 2012-05-31 21:23:25.0

Seika Machinery, Inc. will display its new and innovative products at the upcoming SMTA Upper Midwest Expo & Tech Forum,

Seika Machinery, Inc.

UVLED application burst buffer period, the urgent matter of the moment is to start the technical war

Industry News | 2019-12-16 22:05:41.0

In recent years, as a subdivision of the LED industry, UV LED industry has developed in full swing. In 2019, the UV LED industry is in the buffer phase of application explosion, and the most urgent task for relevant companies is to launch the technology war, in order to capture as many places as possible before the real market explosion.

Beijing Technology Company

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

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