Industry News: pushing (Page 17 of 58)

Aqueous Technologies' MicroJet FC Wins a 2009 Innovation Award

Industry News | 2009-04-23 20:17:27.0

RANCHO CUCAMONGA, CA � April 2009 � Aqueous Technologies Corp. announces that it has been awarded a 2009 EMAsia Innovation Award in the category of Cleaning Equipment for its MicroJet FC. The award was presented to the company during an April 22, 2009 ceremony that took place at The Foyer outside the Grand Ballroom of the Shanghai Everbright International Hotel during Nepcon China 2009.

Aqueous Technologies Corporation

VJ Electronix's 400ST Wins a 2009 Innovation Award

Industry News | 2009-04-23 20:26:21.0

April 2009 � Littleton, Massachusetts. VJ Electronix, Inc. announces that it has been awarded a 2009 EMAsia Innovation Award in the category of Reflow Soldering Equipment Repair/Rework Equipment for its 400ST. The award was presented to the company during an April 22, 2009 ceremony that took place at the Shanghai Everbright International Hotel during Nepcon China 2009.

VJ Electronix

Production Solutions’ RED-E-SET Ultra HD Wins a 2010 Innovation Award

Industry News | 2010-04-22 17:29:04.0

POWAY, CA — Production Solutions Inc. announces that it has been awarded a 2010 EMAsia Innovation Award in the category of Assembly Line Systems/Equipment for its RED-E-SET Ultra HD. The award was presented to the company during an April 21, 2010 ceremony that took place at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2010.

Production Solutions

VJ Technologies’ ECAT Wins a 2010 Innovation Award

Industry News | 2010-04-22 20:48:48.0

VJ Technologies, Inc., the leader in Rework technologies and global provider of advanced X-ray inspection systems, announces that it has been awarded a 2010 EMAsia Innovation Award in the category of Repair/Rework Equipment for its Edge Connector Assembly Tool (ECAT) Reflow System. The award was presented to the company during an April 21, 2010 ceremony that took place at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2010.

VJ Electronix

Bliss Industries to Launch New BlissLift with Increased Capacity

Industry News | 2010-06-23 13:29:48.0

Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, introduces the new BlissLift (BL600) with a more robust column, larger lift platform and increased load capacity.

Bliss Industries, Inc.

Aqueous Technologies' Trident Zero Wins a 2011 EM Asia Innovation Award

Industry News | 2011-05-14 22:41:59.0

Aqueous Technologies announces that it has been awarded a 2011 EM Asia Innovation Award in the category of Cleaning Equipment for its Trident Zero. The award was presented to the company during a May 12, 2011 ceremony that took place at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2011.

Aqueous Technologies Corporation

BTU International Wins EM Asia Innovation Award for TRITAN Metallization Firing Furnace

Industry News | 2011-05-14 22:48:30.0

BTU International announces that it has been awarded a 2011 EM Asia Innovation Award in the category of Alternative Energy - Production Equipment for its TRITAN™ Metallization Firing System. The award was presented to the company during a May 12, 2011 ceremony that took place at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2011.

BTU International

Kyzen's AQUANOX® A4705 Wins Another Industry Award

Industry News | 2011-05-16 12:48:13.0

Kyzen announces that it has been awarded a 2011 EM Asia Innovation Award in the category of Cleaning Materials for its AQUANOX® A4705 Neutral pH Aqueous Cleaning Chemistry.

KYZEN Corporation

Nihon Superior’s SN100C (044) Recognized with a Prestigious 2011 EM Asia Innovation Award

Industry News | 2011-05-16 15:24:12.0

Nihon Superior announces that it has been awarded a 2011 NPI Award in the category of Soldering Equipment for its SN100C (044) Flux-Cored Solder Wire.

Nihon Superior Co., Ltd.

STI Electronics’ Mark McMeen to Discuss Flex Circuit Assembly Issues at the IPC FLEX Conference

Industry News | 2011-06-16 14:28:11.0

STI Electronics announces that Mark McMeen, Vice President of Manufacturing and Engineering Services, will present “Flex Circuit Assembly Issues: What the Fabricator needs to Know” at the upcoming IPC FLEX CONFERENCE, scheduled to take place June 21-23, 2011.

STI Electronics


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