Industry News: qfn (Page 8 of 27)

Don't Miss KYZEN’s QFN Design Considerations to Improve Cleaning during SMTAI

Industry News | 2014-09-19 20:19:38.0

KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.

KYZEN Corporation

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Industry News | 2010-09-15 21:55:19.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

QFN LGA Photos for your Training Courses

Industry News | 2016-12-29 06:52:15.0

One of the largest selection of QFN LGA images of solder joints and defects in the industry to use in your presentations to download online or on CD ROM

ASKbobwillis.com

Guide to QFN/LGA & BTC Process Defects Launched by SMART Group

Industry News | 2017-09-05 16:01:43.0

SMART Group, Europe’s largest technical trade association focusing on Surface Mount And Related Technologies, announces that its latest Process Defect Photo Guide “Guide to QFN/LGA & BTC Process Defects” will be released on 16th October. This optical and X-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts. It shows issues at goods receipt, typical assembly-related problems plus solder joint and cleanliness failures that can occur in the field. The guide provides example images of satisfactory print, placement and reflow with many common defects found with optical and X-ray inspection.

The SMART Group

KYZEN to Participate in a Live Webinar Focusing on QFN Design, Cleaning & Reliability

Industry News | 2016-10-09 21:05:56.0

KYZEN is pleased to announce that Dr. Mike Bixenman and a panel of experts will participate in an informative webinar on Thursday, Oct. 13, 2016. The webinar, entitled, “QFN: Design - Cleaning - Reliability: What you can't see can cause failure!” will be hosted by Global SMT & Packaging Magazine.

KYZEN Corporation

STI and Contributors to Present Results of 2 Research Papers At SMTA International Technical Conference

Industry News | 2019-08-04 20:09:21.0

STI Electronics announces two technical paper presentations in September at the SMTA International Technical Conference (SMTAI).

STI Electronics

What's happening at FINETECH in 2008?

Industry News | 2008-03-25 23:22:33.0

Comment from Neil O�Brien, Director � US Sales

Finetech


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