Industry News | 2014-09-19 20:19:38.0
KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.
Industry News | 2010-09-15 21:55:19.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2010-10-04 15:37:18.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.
Industry News | 2010-11-18 11:04:08.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.
Industry News | 2016-12-29 06:52:15.0
One of the largest selection of QFN LGA images of solder joints and defects in the industry to use in your presentations to download online or on CD ROM
Industry News | 2017-09-05 16:01:43.0
SMART Group, Europe’s largest technical trade association focusing on Surface Mount And Related Technologies, announces that its latest Process Defect Photo Guide “Guide to QFN/LGA & BTC Process Defects” will be released on 16th October. This optical and X-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts. It shows issues at goods receipt, typical assembly-related problems plus solder joint and cleanliness failures that can occur in the field. The guide provides example images of satisfactory print, placement and reflow with many common defects found with optical and X-ray inspection.
Industry News | 2008-11-25 16:50:00.0
Release Date: 1-Nov-2008
Industry News | 2016-10-09 21:05:56.0
KYZEN is pleased to announce that Dr. Mike Bixenman and a panel of experts will participate in an informative webinar on Thursday, Oct. 13, 2016. The webinar, entitled, “QFN: Design - Cleaning - Reliability: What you can't see can cause failure!” will be hosted by Global SMT & Packaging Magazine.
Industry News | 2019-08-04 20:09:21.0
STI Electronics announces two technical paper presentations in September at the SMTA International Technical Conference (SMTAI).
Industry News | 2008-03-25 23:22:33.0
Comment from Neil O�Brien, Director � US Sales
