Industry News | 2021-01-21 18:51:54.0
Vinatronic has just upgraded its X-ray capabilities with a brand-new Glenbrook JewelBox 70T Real Time X-ray Inspection System.
Industry News | 2021-06-11 03:10:46.0
More and more customers switch their SMT BGA QFN soldering quality from X-ray sampling check to 100% fully inline inspection to guarantee its products quality, previously only in automotive, medical, military and aerospace industries, nowadays also applied into high-end consumer electronics PCBA assembly.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2019-08-15 07:31:59.0
AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.
Industry News | 2017-01-09 08:56:28.0
The solder paste and stencil printing photo CD-ROM album featuring over 300 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The images can be downloaded or provided on CD ROM
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Industry News | 2020-02-11 04:22:16.0
Providing process information and solving process defects is what I have been doing for many years with different organisations. In addition we have in the past created reports on 0201 assembly and testing of PCB surface finishes for lead-free assembly
Industry News | 2009-09-18 10:24:30.0
Tempe, AZ - FINETECH will exhibit the FINEPLACER® CRS 10 rework system in booth 322 at the upcoming SMTA International, scheduled for October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA. The system will demostrate rework of 0201 passives, BGA‘s, and QFN devices, as well as residual solder removal.
Industry News | 2009-09-23 21:53:53.0
Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.
