Industry News: qfn fillet height (Page 1 of 2)

IPC INTERNATIONAL ACADEMIC COMPETITION WINNERS TO PRESENT RESEARCH AT IPC APEX EXPO 2012

Industry News | 2012-01-10 19:20:12.0

IPC announced the winning research papers selected in the 2012 IPC International Academic Paper Competition.

Association Connecting Electronics Industries (IPC)

Compact Reference Manuals to IPC-A-610E and IPC J-STD-001 Illustrate Acceptance Criteria in a Handy Format for Inspectors and Operators

Industry News | 2010-09-30 00:35:51.0

The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS

Industry News | 2012-05-30 18:23:07.0

IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics

Association Connecting Electronics Industries (IPC)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

Saki Demonstrates Advanced 3D AOI Capabilities at NEPCON China in Booth 1J25

Industry News | 2017-04-13 17:29:30.0

Saki Corporation will demonstrate the advanced capabilities and new extra component detection (ECD) feature of its BF-3Di 3D automated optical inspection (AOI) systems at NEPCON China on April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center in Shanghai, China, in booth 1J25.

SAKI America

Kyzen’s Mike Bixenman to Hold Cleaning for QFN Rework Presentation at SMTAI 2009

Industry News | 2009-09-17 14:28:17.0

NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

KYZEN Corporation

FINETECH to Demonstrate Compact Rework System at SMTAI 2009

Industry News | 2009-09-18 10:24:30.0

Tempe, AZ - FINETECH will exhibit the FINEPLACER® CRS 10 rework system in booth 322 at the upcoming SMTA International, scheduled for October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA. The system will demostrate rework of 0201 passives, BGA‘s, and QFN devices, as well as residual solder removal.

Finetech

New release of a space-saving compact substrate inspection machine (AOI/SPI) “RV-2”

Industry News | 2015-10-06 19:39:34.0

JUKI released a space-saving compact PWB Inspection Machine "RV-2" at home and abroad in March 18. As a single-lane inspection machine, "RV-2" inherits the high-accuracy inspection capability of the high-end PWB Inspection Machine RV-1. This is an in-line type high-precision PWB inspection machine in space saving compact design.

Juki Automation Systems

Koh Young Exhibiting its Industry-leading 3D Inspection Solutions at SMT Hybrid Packaging 2018

Industry News | 2018-05-14 09:06:17.0

Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.

Koh Young America, Inc.

Koh Young Exhibiting its Industry-leading 3D Inspection Solutions at SMT Hybrid Packaging 2018

Industry News | 2018-05-14 09:06:21.0

Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.

Koh Young America, Inc.

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