Industry News: qfn solder ball (Page 9 of 67)

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

IPC Conference on Reliability Highlights New Findings in All Areas of Electronics Assembly

Industry News | 2011-08-24 17:13:21.0

The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.

Association Connecting Electronics Industries (IPC)

SMTA Beantown Bonanza

Industry News | 2003-04-10 07:58:34.0

The answers that you need to stay competitive in today's market

Surface Mount Technology Association (SMTA)

Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling

Industry News | 2010-04-10 02:05:54.0

IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.

Association Connecting Electronics Industries (IPC)

Join OK International at Enova Grand Ouest in France for a Demonstration of Metcal’s New MX-5200

Industry News | 2013-02-27 15:04:56.0

February 2013 ― OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France.

Association Connecting Electronics Industries (IPC)

How Electronic / Electrical Circuit Works

Industry News | 2018-12-08 03:33:27.0

How Electronic / Electrical Circuit Works

Flason Electronic Co.,limited

Design Decisions That Reduce Manufacturing Costs

Industry News | 2018-10-18 10:06:45.0

Design Decisions That Reduce Manufacturing Costs

Flason Electronic Co.,limited

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2018-06-26 20:35:35.0

The SMTA is pleased to announce that the program and registration for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai. Taking place October 14-18, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Surface Mount Technology Association (SMTA)

SMTA China Presents Nine Best-Paper / Oustanding Paper / Best Presentation Awards and Two Best Exhibit Awards at SMTA China East 2016 Conference / Nepcon China 2016

Industry News | 2016-05-09 21:21:15.0

SMTA China announces that it presented awards for Nine papers at the SMTA China East 2016 Conference Award Presentation Ceremony, held on Tuesday, April 26, 2016 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)


qfn solder ball searches for Companies, Equipment, Machines, Suppliers & Information