Industry News | 2016-04-21 19:00:55.0
Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11 in Toronto, Canada. Sandy-Smith will present How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study. This presentation will include data from several studies that demonstrate how stencil design and reflow profile optimization impacts voiding levels and variation in material comparison testing.
Industry News | 2016-03-03 08:45:28.0
Henkel Adhesive Technologies today announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. A one-part, thermally conductive, liquid formable gel, Liqui-Form 3500 combines high thermal conductivity with process flexibility and excellent reliability.
Industry News | 2014-01-31 00:23:23.0
Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
Industry News | 2016-01-20 12:31:34.0
Indium Corporation's Brandon Judd, Technical Support Engineer, will present at the Surface Mount Technology Association (SMTA) Rocky Mountain chapter meeting on Jan. 26 at the Mile High Stadium in Denver, Colo.
Industry News | 2015-10-15 12:35:31.0
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla. Jensen's course, Improving Mechanical, Electrical, and Thermal Reliability of Electronics, provides practical knowledge that can be applied to current processes to improve the overall reliability of electronics assemblies.
Industry News | 2020-11-09 14:19:56.0
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present during IMAPS-UK/IEEE-EPS'sonline thermal management conference from Nov. 25-26.
Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Industry News | 2014-03-04 11:29:02.0
Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.
Industry News | 2019-06-27 08:33:27.0
BTU International is pleased to announce that the new Pyramax Vacuum Reflow Oven has been installed at ACI Technologies’ showroom and demo center. This is the second machine at ACI, the first was a Pyramax Convection Reflow Oven.
Industry News | 2010-03-24 13:42:48.0
San Diego - March 2010 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, will share the latest science and products for reliable nondestructive methods of profiling in booth #1549 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
