Industry News | 2010-09-29 23:32:58.0
Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2010-10-01 01:05:06.0
Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2011-04-20 17:38:48.0
Multitest announces that its well-established ECON® contactor once again has proven its superior cost of test. The contactor recently exceeded 4.5 mio insertions at an Asian test house.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2015-10-18 20:03:37.0
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla.
Industry News | 2016-02-16 20:18:38.0
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.
Industry News | 2023-12-18 13:13:45.0
SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.
Industry News | 2010-09-08 11:49:17.0
PCB Fabricator Installs MASS VHF 300 VS for Via Hole Filling Addressing the continuous demands pertaining to via hole filling, through holes and blind vias
Industry News | 2014-07-29 12:33:11.0
Several Indium Corporation technology experts will lead technical sessions at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
Industry News | 2014-02-27 11:48:51.0
Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.
