Industry News: qfn thermal pad (Page 2 of 26)

What is the working principle of I.C.T Lyra Reflow Oven

Industry News | 2022-11-11 07:33:41.0

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.

Dongguan Intercontinental Technology Co., Ltd.

FREE Download of Failures Analysis Booklet from ACI Technologies

Industry News | 2016-11-30 14:47:45.0

ACI Technologies invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at http://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Digital-Download-P181.aspx

ACI Technologies, Inc.

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Industry News | 2018-04-18 18:06:14.0

SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

SMTA International Technical Committee Announces Best Presentation & Papers Awards from the 2018 Conference

Industry News | 2019-01-30 08:13:02.0

The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.

Surface Mount Technology Association (SMTA)

Best Papers from SMTA International Announced

Industry News | 2023-03-16 14:31:59.0

The SMTA is pleased to announce the Best Papers from SMTA International 2022. The winners were selected by members of the conference technical committee. For these exceptional achievements, a plaque is given to primary authors of all winning papers.

Surface Mount Technology Association (SMTA)

IPC Releases IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

Industry News | 2021-02-15 14:41:46.0

– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS

Industry News | 2012-05-30 18:23:07.0

IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for 2014 IPC APEX EXPO

Industry News | 2013-04-03 18:46:12.0

IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

IPC Issues Technical Conference Participation Call for IPC APEX EXPO 2016

Industry News | 2015-08-23 09:03:52.0

IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2016 at the Las Vegas Convention Center in Las Vegas. The technical conference will be held March 15-17, 2016. The deadline for technical conference paper abstracts has been extended to September 14,, 2015.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2017

Industry News | 2016-04-29 11:38:38.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017.

Association Connecting Electronics Industries (IPC)


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