Industry News | 2010-08-27 07:25:03.0
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
Industry News | 2024-05-13 10:19:11.0
SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.
Industry News | 2023-03-27 14:51:47.0
We are thrilled to announce that YINCAE has some exciting news to share with you! We have recently introduced a breakthrough technology - thermal underfill UF 158A2 which can dramatically shorten the manufacturing process and improve the heat dissipation.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2014-08-05 17:29:07.0
Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2015-01-20 18:02:54.0
Metcal today announced plans to exhibit in Booth #627 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be displayed for the first time, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
Industry News | 2015-01-20 23:40:52.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.
Industry News | 2015-03-17 16:10:02.0
Metcal today announced plans to exhibit in Booth B-1G26 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be displayed for the first time in Asia, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
Industry News | 2015-07-21 08:12:52.0
Metcal today announced plans to exhibit in Booth B-1G26 at NEPCON South China, scheduled to take place Aug. 25-27, 2015 at the Shenzhen Convention & Exhibition Center. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be on display, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
Industry News | 2017-07-10 21:20:40.0
KIC announces the appointment of Larry Fey as Principal Electrical Engineer. Fey is an exceptionally skilled and accomplished electrical engineer with more than 27 years of hands-on design experience. He has been active in all phases of product development, including feasibility studies, planning, design, CAD, assembly, testing, field trials, production support and customer assistance.
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