Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2008-12-15 15:28:33.0
LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
Industry News | 2015-10-05 18:14:25.0
Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.
Industry News | 2013-04-30 11:00:43.0
VJ Electronix, Inc., announces that it has been awarded Best Paper of Vendor Conference 3 at the SMTA China East 2013 Award Presentation Ceremony for the presentation titled “Overcoming Today’s Rework Challenges.”
Industry News | 2014-05-28 15:31:54.0
VJ Electronix, Inc. announces that Gabor Homolya will present at Emerging Electronics 2014, scheduled to take place June 24-25, 2014 at SMS Electronics’ Beeston Head Office in Nottingham.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2007-02-14 15:40:22.0
New ThermaSim Is First Online Simulation Tool to Use Finite Element Analysis Models for Increased Accuracy
Industry News | 2024-02-19 12:13:44.0
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will present a technical paper on January 31 at IMAPS France – 17th European Advanced Technology Workshop on Micropackaging and Thermal Management in La Rochelle, France.
