Industry News | 2014-04-10 10:17:27.0
AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
Industry News | 2007-11-27 12:01:32.0
FINETECH application packages offered for FINEPLACER� rework systems provide an easy way to enhance the machine�s scope of application. These packages include custom-tailored modules and tools to ensure perfect results for special rework applications.
Industry News | 2014-04-07 20:04:08.0
Metcal today announced that it will showcase industry-leading products in Booth #9-327 at SMT/Hybrid/Packaging, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2018-09-23 09:45:16.0
BTU International is pleased to announce that Fred Dimock, Manager of Process Technology, will present at ACI Technologies’ Open House. The event will take place on Tuesday, Sept. 25, 2018 on ACI’s manufacturing factory floor at its facility in Philadelphia, PA.
Industry News | 2010-05-04 21:09:23.0
Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.
Industry News | 2014-08-14 21:44:44.0
Several Indium Corporation experts will share their technical knowledge with attendees at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
Industry News | 2017-03-23 13:05:52.0
Metcal today announced plans to exhibit at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase its convection rework and hand soldering systems and tools, including the new CV-5200 Connection Validation™ Soldering Station and High Thermal Demand upgrade kit in Stand 1H39.
Industry News | 2014-11-07 10:35:14.0
AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.
Industry News | 2015-04-06 16:02:12.0
Metcal today announced plans to exhibit at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 in Nuremberg Germany. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be showcased in the SmartTec Stand 321, hall 7, along with the Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.
Industry News | 2021-06-17 15:18:27.0
Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
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