Industry News: qfn thermal pad (Page 17 of 26)

AI Technology, Inc (AIT) To Attend and Present Paper at IWLPC. AIT also attending IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference.

Industry News | 2014-11-07 10:35:14.0

AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.

AI Technology, Inc. (AIT)

Practical Components' Free Dummy Component Catalog Helps Save Money and Improve Production

Industry News | 2011-07-26 20:55:54.0

Practical Components announces that the illustrated 2011-2012 Dummy Component Catalog is complete, free of charge and now available.

Practical Components, Inc.

Multitest Offers Powerful Plug & Yield Solution for High Power Applications MT9928 Gravity Handler, ecoAmp Contactor and Multitest PCB

Industry News | 2012-07-19 13:24:57.0

Multitest, announces that its MT9928 gravity handler ideally supports the special features of the recently launched ecoAmp Kelvin contactor.

Multitest Elektronische Systeme GmbH

Indium8.9HFA Solder Paste Sees Accelerated Adoption for Miniaturized Assemblies

Industry News | 2013-11-01 13:32:41.0

Indium Corporation's Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace.

Indium Corporation

Debbie Carboni to Present “Design for Cleaning” at SMTA Philadelphia Expo

Industry News | 2014-07-15 14:38:39.0

Kyzen announces that it will exhibit AQUANOX® A4639 Electronic Assembly Aqueous Solution at the SMTA Philadelphia Expo & Tech Forum, scheduled to take place Tuesday, August 12, 2014 at the Crowne Plaza Philadelphia in New Jersey.

KYZEN Corporation

Indium Corporation Expert to Present at Electronic Components and Technology Conference

Industry News | 2022-04-28 14:33:02.0

Indium Corporation® Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.

Indium Corporation

Everett Charles Technologies to Attend BiTS Socket Workshop 2009

Industry News | 2009-03-06 14:54:52.0

Everett Charles Technologies will display advanced technologies in booth A44 at the upcoming Bits BGA Socket Workshop, scheduled to take place March 8-11, 2009 at the Hilton Phoenix East/Mesa Hotel Mesa in Arizona.

Everett Charles Technologies

Metcal to Launch Connection Validation – the Latest Innovation in Hand Soldering – at APEX

Industry News | 2017-01-11 18:13:13.0

Metcal today announced plans to exhibit at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The company will showcase its hand soldering systems and tools, the Scarab Site Cleaning System, Scorpion Rework System, and fume extraction systems in Booth #3035.

Metcal

New Yorker Electronics announces CDE's release of the New Screw Terminal Capacitors with Extended Cathode Construction

Industry News | 2022-09-12 15:02:28.0

New Cornell Dubilier Series is its Highest Aluminum Electrolytic Capacitance Value Provides Long Life and Increased Vibration Performance

New Yorker Electronics

Indium Corporation Features New Probe-Testable Solder Paste at APEX

Industry News | 2008-02-28 15:03:16.0

Indium8.9 Pb-Free Solder Paste is an air reflow no-clean solder paste that prints perfectly every time.

Indium Corporation


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