Industry News | 2011-07-27 22:46:46.0
SinkPAD Corporation’s Vice President of Marketing and Business development Sam Bhayani has announced that his company SinkPAD Corporation will be performing comparative thermal profiling right at their booth (#264) next week at the LED show in Las Vegas July 27th.
Industry News | 2010-12-10 12:27:00.0
Ironwood Electronics recently introduced a new spring pin socket addressing precise resistance measurement need for testing power management devices - SSK-QFN-7000.
Industry News | 2009-03-18 17:08:59.0
FINETECH will demonstrate today's most requested advanced rework applications in booth #2059 at the upcoming APEX 2009, scheduled to take place March 31 � April 2, 2009 at the Mandalay Bay Convention Center in Las Vegas.
Industry News | 2014-03-20 14:21:26.0
COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.
Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2011-07-14 13:20:33.0
SinkPAD Corporation will be exhibiting at the LED show in Las Vegas introducing their new Cool down Aluminum PCB applications. The LED show and conference is on July 26th and 27th, the conference is both days while the expo is on the 27th.
Industry News | 2012-02-23 16:37:47.0
A rework station with higher-resolution split-vision for easier and more accurate alignment has been introduced by Manncorp. The lead-free system BR750, to be exhibited at Manncorp’s APEX booth #2907, also contains ultra-precise processing controls to meet the challenge of removal and placement of BGAs, CSPs, QFNs, PoPs and other subminiature surface mount devices.
Industry News | 2011-07-18 12:16:56.0
SinkPAD Corporation’s customer Wild Ideas Light Company today expressed their appreciation for SinkPAD’s PCB cooling technology.
Industry News | 2010-09-15 21:55:19.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2010-10-04 15:37:18.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.
