Industry News: qfn thermal pad (Page 9 of 26)

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

Mentor Graphics Announces Next-Generation PADS Flow with Chinese Language Support, Interactive Routing, and Usability Enhancements

Industry News | 2012-11-05 19:42:49.0

Mentor Graphics announced the availability of the next-generation PADS® flow with the introduction of PADS 9.5. This release adds usability enhancements, GUI improvements in DxDesigner®, interactive routing updates, and availability in Simplified Chinese language. The scalable PADS 9.5 flow enables users to cost-effectively design their products, from standard PCBs to the industry’s most complex, highest performance, and densest PCBs.

Mentor Graphics

Mentor Graphics Announces PADS PCB Product Creation Platform with Voltage Drop and Electronic Cooling Capabilities

Industry News | 2016-05-05 20:33:25.0

Mentor Graphics Corporation (NASDAQ: MENT) today announced a comprehensive product-creation platform based on PADS® PCB software that enables individual engineers and small teams to solve the engineering challenges involved in creating today’s electronic products. With increasing systems design complexity and the need for printed circuit board (PCB), mechanical and systems engineers to access easy-to-deploy tools, the PADS platform has been extended to enable engineers to develop PCB-based systems from concept through manufacturing hand-off.

Mentor Graphics

The Design Principles of Stencil Apertures

Industry News | 2018-10-18 10:24:05.0

The Design Principles of Stencil Apertures

Flason Electronic Co.,limited

AI Technology, Inc. (AIT) Releases Cool-Gumpad™ (Thermal Interface Pad) CGP7156

Industry News | 2014-06-05 12:21:18.0

AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.

AI Technology, Inc. (AIT)

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

FCT Assembly Solves Bridging Issues at Reflow

Industry News | 2012-04-09 13:45:59.0

As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.

FCT ASSEMBLY, INC.

Mentor Graphics Announces PADS Release Targeting Design-for-Manufacturing (DFM) Analysis, High-Speed and Interactive Routing

Industry News | 2012-03-07 22:05:34.0

Mentor Graphics announced the latest release of the PADS® product suite, the world’s most widely used desktop PCB design solution. These additional features in the release add significant value to electronics companies as they strive to deliver the most competitive, high-performance products to market faster.

Mentor Graphics

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

Industry News | 2011-05-10 19:11:40.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.

MARTIN (a Finetech company)


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