Industry News | 2007-11-27 12:01:32.0
FINETECH application packages offered for FINEPLACER� rework systems provide an easy way to enhance the machine�s scope of application. These packages include custom-tailored modules and tools to ensure perfect results for special rework applications.
Industry News | 2013-03-12 14:11:50.0
After successfully launching the first X3 In-line X-Ray system in 2011, MatriX Technologies now presented its new X3L system in the USA. As of this year, besides the universal 3D inspection system X3, the X3L configuration is available with an innovative dual detector concept, combining a line-scan for transmission inspection of complete PCBs in a few seconds and a high-resolution digital flatpanel detector for selective 3D image capturing.
Industry News | 2024-02-19 12:13:44.0
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will present a technical paper on January 31 at IMAPS France – 17th European Advanced Technology Workshop on Micropackaging and Thermal Management in La Rochelle, France.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2022-04-28 14:33:02.0
Indium Corporation® Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.
Industry News | 2010-07-16 16:08:56.0
Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces in-stock availability of the popular 15 mm PoP Thermal Cycling Board.
Industry News | 2012-09-12 17:00:31.0
Nihon Superior Co. Ltdwill introduce newly developed solder paste for low voiding in soldering processes and materials
Industry News | 2021-03-06 03:21:15.0
The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2021-08-28 04:15:29.0
Shrinking stencil apertures and gaps between padshave necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on finefeature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.
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