Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2017-11-09 14:55:51.0
BPM Microsystems is demonstrating its new 4900 automated programming system at Productronica. The 4900, with its advanced chip-scale part (CSP) device handling, on-the-fly vision alignment, and HS400 programming speeds, satisfies a vast range of programming needs in one automated system. Featuring high-performance laser marking and 3D inspection, the 4900 provides advanced serialization and quality control, meeting the highest programming and cyber security standards for automotive, aerospace, medical, industrial and mobile device industries.
Industry News | 2016-10-04 16:30:12.0
Viscom has developed advanced software to enable highly precise 3D image acquisition in the automatic optical inspection (AOI) area that the company will display in Stand A1.217 at electronica, scheduled to take place Nov. 8-11, 2016 at the Messe München.The representation of side views of electronic components, a pronounced weak point on many 3D systems with orthogonal cameras, can now be displayed in realistic detail with the angled cameras of the Viscom camera modules on the new 360View.
Industry News | 2008-10-12 22:46:32.0
BEDFORD, NH � October 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, now offers capability measurement analysis of leaded devices.
CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)
Industry News | 2010-05-29 18:01:49.0
TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections.
Industry News | 2016-04-01 05:03:10.0
JBC, a leading manufacturer of soldering and rework equipment, has redesigned its manual solder feed iron AP130.
Industry News | 2021-04-01 09:23:35.0
Low cost SMT assembly line solution is including 7 machines. It can mount chips: 0201, 0402, 0603, 0805, 1206, diode, transistor, SOT, and QFP/BGA which the size within 40*40mm and lead pitch ≥0.3mm etc. Any inquiry would be appreciated by Mobile/WeChat: 0086 13063047785 or scan my WeChat QR code. Yours sincerely Wellman Rau Senior Manager International Business Dept. Mobile/Wechat/WhatsApp: +86 130 6304 7785 Skype: wellmanrau@yeah.net Email: wellmanrau@yeah.net
Industry News | 2021-08-13 22:06:35.0
The compressor of a refrigerator plays a key role in the cooling effect of the refrigerator, as well as the refrigeration cycle. One side of the compressor pulls the gaseous refrigerant to the other side by suction and then pushes it out. If you need to repair the refrigerator or locate the low side of the compressor, a simple visual inspection will be all you need.
Industry News | 2014-05-23 15:35:56.0
New High Precision Rotary Head Handles Multiple QFP Processing for Higher Efficiency
Industry News | 2002-12-03 15:00:11.0
Practical Components adds new formulations
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