Industry News: qfp features (Page 1 of 5)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

FPGAs and Microcontrollers

Industry News | 2018-10-18 10:34:11.0

FPGAs and Microcontrollers

Flason Electronic Co.,limited

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

RPS Delivers Innovation in High Volume Lead Tinning

Industry News | 2014-05-23 15:35:56.0

New High Precision Rotary Head Handles Multiple QFP Processing for Higher Efficiency

Hentec Industries, Inc. (RPS Automation)

Seika Machinery Introduces PR1 Pocket Handy BGA Solder Ball Checker

Industry News | 2010-05-29 18:01:49.0

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections.

Seika Machinery, Inc.

FCT Assembly Premiers WS159 Tin-Lead Water-Soluble Solder Paste

Industry News | 2009-05-18 17:19:51.0

GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.

FCT ASSEMBLY, INC.

FCT Assembly Introduces WS177 Lead-Free, Water-Soluble Solder Paste

Industry News | 2009-05-20 19:17:30.0

GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.

FCT ASSEMBLY, INC.

FCT Assembly Debuts NC676 No-Clean Leaded Solder Paste

Industry News | 2010-10-26 22:46:06.0

FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.

FCT ASSEMBLY, INC.

Solder Paste & Stencil Printing Defect Examples Available Royalty FREE

Industry News | 2017-01-09 08:56:28.0

The solder paste and stencil printing photo CD-ROM album featuring over 300 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The images can be downloaded or provided on CD ROM

ASKbobwillis.com

Seika Machinery Debuts Seika TV on Its Enhanced Web Site

Industry News | 2012-03-21 15:19:00.0

Seika Machinery has introduced its updated Web site at its existing Web address: www.seikausa.com.

Seika Machinery, Inc.

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