Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2011-07-27 22:46:46.0
SinkPAD Corporation’s Vice President of Marketing and Business development Sam Bhayani has announced that his company SinkPAD Corporation will be performing comparative thermal profiling right at their booth (#264) next week at the LED show in Las Vegas July 27th.
Industry News | 2011-07-14 13:20:33.0
SinkPAD Corporation will be exhibiting at the LED show in Las Vegas introducing their new Cool down Aluminum PCB applications. The LED show and conference is on July 26th and 27th, the conference is both days while the expo is on the 27th.
Industry News | 2011-07-18 12:16:56.0
SinkPAD Corporation’s customer Wild Ideas Light Company today expressed their appreciation for SinkPAD’s PCB cooling technology.
Industry News | 2010-09-21 09:46:59.0
Dynamic Advance Allows Engineers to Instantaneously Map and Measure Pressure Distribution between Heat Sinks and Components in Real Time
Industry News | 2007-08-21 17:31:51.0
PC104p Products Rugged chassis with built in heat sink, mounting flange, gaskets, and an internal shock mounted card cage. Chassis is available in multiple lengths.
