Industry News | 2014-02-17 20:17:14.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, and SPI Inspection Systems at IPC APEX 2014 booth #2263.
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2013-01-16 11:21:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013
Industry News | 2015-01-21 21:05:20.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.
Industry News | 2023-10-30 01:28:24.0
In the fast-paced world of electronics manufacturing, achieving precision and efficiency is paramount. The LCO-350 PCB Laser Depanelizer stands as a revolutionary solution, pushing the boundaries of PCB (Printed Circuit Board) cutting technology.
Industry News | 2018-02-05 21:08:33.0
When the IPC APEX EXPO show floor opens on Tuesday, February 27, more than 20 equipment vendors, software providers and customers from across the electronics industry will participate in an IPC Connected Factory Exchange (CFX) Showcase. The IPC CFX Showcase -- a technological demonstration operating in real time -- will deliver standardized machine data from participating exhibitors through the cloud and onto visitors’ mobile phones.
Industry News | 2024-01-24 07:26:07.0
I.C.T introduces the PCB Double-Sided Coating Line, a cutting-edge solution catering to diverse manufacturing needs. This innovative technology enhances surface coating capabilities for PCBs, addressing the evolving demands of the industry.
Industry News | 2010-04-10 02:05:54.0
IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.
Industry News | 2017-09-07 17:40:17.0
IPC's biennial Wage Rate and Salary Survey for the North American Electronics Assembly Industry is open and the deadline has been extended until September 29. The 2017 study covers 40 hourly and salaried positions in electronics assembly companies North America, including OEMs and contract manufacturers. It is intended for executive management and HR professionals who can provide data on a range of positions and policies.
Industry News | 2019-10-24 10:29:42.0
IPC's biennial wage rate and salary survey for the North American electronics assembly industry is open with a response deadline of November 1. The confidential survey covers compensation for 40 hourly and salaried technical, manufacturing and sales positions at original equipment manufacturers (OEMS) and contract electronics manufacturing services (EMS) companies in North America. It also covers salary budget growth, planned increases for 2020, and employee benefits and policies.
