Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2015-01-25 15:25:24.0
Kurtz Ersa North America will exhibit in Booth #2601 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. For the first time, Ersa will display the new Smartflow 2020 selective soldering system and HOTFLOW 3/20 third generation reflow oven.
Industry News | 2021-06-16 10:54:26.0
XJTAG®, a leader in JTAG boundary scan test solutions, announces the introduction of Serial Wire Debug (SWD) support, user-defined libraries, a new clock generator, and other benefits in its latest software release, XJTAG 3.11.
Industry News | 2013-09-18 12:09:19.0
ADLINK Technology today announced availability of the enhanced aTCA-6250 and aTCA-6200A, AdvancedTCA® (ATCA) processor blades with robust computing power, high throughput connectivity, and accelerated packet processing capabilities.
Industry News | 2014-03-20 10:03:43.0
ADLINK Technology announced an array of new products in various form factors based on the latest Intel® Atom™ and Celeron® processors for intelligent systems, featuring a significant performance per watt improvement over previous generations, high integration of both low speed and high speed IO’s, an advanced graphics engine, and virtualization support - all on a sub-10-watt system-on-chip (SoC) that enables small, light, and reliable embedded designs.
| 1 |
