Industry News: quad qsp 2 (Page 9 of 14)

Pickering Interfaces to Feature Latest RF and Microwave Switching Solutions at IEEE MTT-S 2017 International Microwave Symposium (IMS)

Industry News | 2017-04-26 19:35:20.0

Pickering Interfaces will showcase their broad catalog of PXI and Ethernet LXI RF & Microwave switching solutions at IEEE MTT-S 2017 International Microwave Symposium (IMS) at booth #2040 on June 6 – 9, 2017.

Pickering Interfaces Ltd.

Ersa to Show the New SMARTFLOW 2020 and HOTFLOW Systems

Industry News | 2015-01-25 15:25:24.0

Kurtz Ersa North America will exhibit in Booth #2601 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. For the first time, Ersa will display the new Smartflow 2020 selective soldering system and HOTFLOW 3/20 third generation reflow oven.

kurtz ersa Corporation

VJ Electronix Announces Competitive Price Reduction on XQuik X-ray Component Counters

Industry News | 2021-09-06 04:33:06.0

VJ Electronix, Inc. today announced a competitive price reduction on its XQuik Series Component Counters. The reduction is across its entire XQuik line, which includes the XQuik II Plus, XQuik II Plus Autoload and XQuik III.

VJ Electronix

Parvus Combines Low-Power 5x86 AMD� CPU with Dual 10/100 Ethernet Controllers and Quad Serial Ports in SpacePC� 4200 PC/104-Plus Single Board Computer

Industry News | 2003-11-20 13:29:11.0

SpacePC� 4200 CPU provides a small form factor 32-bit processor module with strong network and communication functionality for embedded systems apps

Parvus Corporation

ADLINK Releases LEC-iMX6 SMARC® Module with Freescale i.MX6 System-on-Chip

Industry News | 2014-12-30 08:36:58.0

ADLINK Technology, Inc. today introduced a new SMARC® form factor computer-on-module running a Freescale i.MX6 processor based on the ARM Cortex-A9 architecture. With a choice of dual or quad-core processors running at from 800 MHz to 1.2 GHz with soldered memory up to 2GB DDR3L-1066/1333.The ADLINK LEC-iMX6 delivers top-of-the-line performance with efficient power consumption that targets a new generation of mobile applications requiring industrial-grade stability and reliability and supports an extremely wide operating temperature range of -40°C to +85°C thanks to ADLINK’s proven Extreme Rugged™ technology.

ADLINK Technology, Inc.

ADLINK Releases aTCA-3710 40G AdvancedTCA® Switch Blade for Bandwidth-demanding Applications

Industry News | 2014-04-24 11:49:00.0

ADLINK Technology today announced the availability of its new 40G AdvancedTCA® (ATCA) switch blade, the aTCA-3710, featuring a Broadcom BCM56846 10/40 GbE Fabric Interface Switch, Broadcom BCM56334 24-port GbE Base Interface Switch and Freescale QorIQ P2041 quad-core Local Management Processor.

ADLINK Technology, Inc.

ADLINK Introduces Ready-to-Go Smart Camera with MVTec MERLIC

Industry News | 2017-03-09 23:23:26.0

ADLINK Technology today announced the release of its new NEON-1021-M Intel® Atom™ E3845 processor-based ready-to-go smart camera with MVTec MERLIC. Equipping its state-of-the-art quad-core smart camera with an easy-to-use machine vision software, the NEON-1021-M significantly increases competitive advantage, exceeding basic smart camera advantages for machine vision development.

ADLINK Technology, Inc.

ASSET(R) is First to Support Intel(R)'s New Atom(TM) Processor with CPU Emulation Test and Diagnostics

Industry News | 2008-04-01 21:08:46.0

�Master support for Atom joins ASSET's ScanWorks� support for Intel�s

ASSET InterTech, Inc.

AUTOTESTCON will see the Launch of New Switching Solutions and Software from Pickering Interfaces

Industry News | 2016-09-07 19:24:27.0

Pickering Interfaces will be showcasing their latest PXI & LXI switching and simulation solutions and software at AUTOTESTCON – September 12-15, 2016. These new products include:

Pickering Interfaces Ltd.

FINETECH to Present at SMT/HYBRID/PACKAGING

Industry News | 2009-04-23 20:46:52.0

FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.

Finetech


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