Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2016-01-22 11:30:09.0
The greater visibility of ASSET® InterTech’s SourcePoint™ software debugger now enables engineers to quickly find the root causes of bugs in complex multithreaded code running on AppliedMicro®’s 64-bit ARM®-based HeliX® 2 family of system-on-a-chip (SoC) devices for the embedded market.
Industry News | 2015-08-18 14:11:22.0
Advanced technology compact PC controller is ideal for fit-and-forget installations.
Industry News | 2014-09-26 21:26:04.0
ACD, a full-service EMS company, is pleased to welcome Aqueous Technologies’ customers to its facility for demonstrations.
Industry News | 2015-10-21 17:15:18.0
Fancort Industries, Inc. will exhibit in Hall B2, Booth 389 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Fancort is a leader in the design and fabrication of lead forming and cutting equipment, primarily for SMDs and some through-hole applications. The company will showcase its wide selection of equipment and services designed to meet all requirements from prototype to moderate production, specializing in processing high-reliability aerospace grade devices to exacting SMT tolerances. Fancort will display its standard line of SMT products, including:
Industry News | 2014-07-10 21:52:16.0
ADLINK Technology today announced the VPX6000, a rugged 6U VPX blade featuring a dual processor design based on quad-core 4th generation Intel® Core™ i7-4700EQ processors. The VPX6000 is a high performance blade designed to meet MIL-STD-810F, for harsh environments and provide the high-availability required for mission critical applications, including radar, sonar, UAV and UGV in defense and aerospace.
Industry News | 2020-01-30 09:45:27.0
Embedded World 2020: ARIES Embedded Integrates Industry’s First Multi-Core RISC-V System-on-Chip FPGA
Industry News | 2014-07-23 13:15:08.0
ADLINK Technology today introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability.
Industry News | 2015-01-25 15:25:24.0
Kurtz Ersa North America will exhibit in Booth #2601 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. For the first time, Ersa will display the new Smartflow 2020 selective soldering system and HOTFLOW 3/20 third generation reflow oven.
Industry News | 2014-12-30 08:36:58.0
ADLINK Technology, Inc. today introduced a new SMARC® form factor computer-on-module running a Freescale i.MX6 processor based on the ARM Cortex-A9 architecture. With a choice of dual or quad-core processors running at from 800 MHz to 1.2 GHz with soldered memory up to 2GB DDR3L-1066/1333.The ADLINK LEC-iMX6 delivers top-of-the-line performance with efficient power consumption that targets a new generation of mobile applications requiring industrial-grade stability and reliability and supports an extremely wide operating temperature range of -40°C to +85°C thanks to ADLINK’s proven Extreme Rugged™ technology.
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