Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2014-09-26 21:26:04.0
ACD, a full-service EMS company, is pleased to welcome Aqueous Technologies’ customers to its facility for demonstrations.
Industry News | 2015-08-18 14:11:22.0
Advanced technology compact PC controller is ideal for fit-and-forget installations.
Industry News | 2015-10-21 17:15:18.0
Fancort Industries, Inc. will exhibit in Hall B2, Booth 389 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Fancort is a leader in the design and fabrication of lead forming and cutting equipment, primarily for SMDs and some through-hole applications. The company will showcase its wide selection of equipment and services designed to meet all requirements from prototype to moderate production, specializing in processing high-reliability aerospace grade devices to exacting SMT tolerances. Fancort will display its standard line of SMT products, including:
Industry News | 2016-07-10 12:08:40.0
All our training workshops are run on site at your manufacturing facility, conference or exhibition venues worldwide. We offer the largest range of topics in the industry
Industry News | 2014-07-10 21:52:16.0
ADLINK Technology today announced the VPX6000, a rugged 6U VPX blade featuring a dual processor design based on quad-core 4th generation Intel® Core™ i7-4700EQ processors. The VPX6000 is a high performance blade designed to meet MIL-STD-810F, for harsh environments and provide the high-availability required for mission critical applications, including radar, sonar, UAV and UGV in defense and aerospace.
Industry News | 2021-06-08 09:26:10.0
ARIES Embedded Expands System-on-Modules Product Range with First RISC-V Based FPGA ModuleARIES Embedded Expands System-on-Modules Product Range with First RISC-V Based FPGA Module
Industry News | 2014-09-03 14:13:33.0
ADLINK Technology today announced availability of its new 3U CompactPCI® processor blade, the cPCI-3620, which runs on a low power, quad-core Intel® Atom™ System-on-Chip (SoC) carrying up to 4GB DDR3L-1333 ECC soldered memory and providing ample computing power with a thermal envelope of less than 10W.
Industry News | 2014-07-23 13:15:08.0
ADLINK Technology today introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability.
Industry News | 2020-01-30 09:45:27.0
Embedded World 2020: ARIES Embedded Integrates Industry’s First Multi-Core RISC-V System-on-Chip FPGA
