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New Technology for Void-free Reflow Soldering
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How to Prevent Non-Wetting Defect during the SMT Reflow Process
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How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
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Printed Circuit Board (PCB) Price Estimator
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How much does Automated PCB Assembly Cost?
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Inexpensive 4 Layer PCB Prototyping
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Fred Dimock, process technology manager at BTU International, will present a paper titled “Experiences in Transferring Recipes from an Eight Zone Reflow Oven to a Ten Zone Oven” at the upcoming SMTA International Conference.