Industry News: radar absorbing material (Page 2 of 11)

Engineered Conductive Materials introduces DB-1588 Low Cost Conductive Adhesive for Back Contact Solar Modules

Industry News | 2011-11-08 13:28:32.0

Engineered Conductive Materials introduces its DB-1588 low-cost conductive adhesive for back contact applications in crystalline silicon solar modules.

Engineered Conductive Materials, LLC

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Industry News | 2016-09-13 21:04:26.0

Engineered Materials Systems today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.

Engineered Materials Systems, Inc.

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small- to Medium-Size Chip Bonding

Industry News | 2016-11-15 18:10:16.0

Engineered Materials Systems today announced its new EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small- to medium-size die and tantalum capacitors. EMS 561-854 is designed to cure in one minute at 170ºC.

Engineered Conductive Materials, LLC

Indium Corporation Announces High-Melting Pb-free Solder Alternatives Agreement with Ormet Circuits

Industry News | 2010-04-23 18:53:17.0

Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.

Indium Corporation

Nihon Superior's High Ductility Lead-free Solder Provides High Impact Strength

Industry News | 2009-03-06 15:54:16.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.

Nihon Superior Co., Ltd.

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules

Industry News | 2015-07-21 08:21:52.0

Engineered Materials Systems introduced its new EMS 561-403 Low-Cost Snap Cure Conductive Adhesive for stringing applications in crystalline silicon and thin-film solar modules. EMS 561-403 is designed to electrically interconnect solar cells using ribbons.

Engineered Materials Systems, Inc.

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Industry News | 2016-08-08 20:27:23.0

Engineered Materials Systems is pleased to introduce its new EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

Engineered Materials Systems, Inc.

High-Tech Conversions to Showcase FREE-SAT Wipes at Nepcon East 2007

Industry News | 2007-10-24 17:17:32.0

EAST WINDSOR, CT � October 24, 2007 � High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that it will feature FREE-SAT presaturated wipes in booth 1017 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center in Boston.

High-Tech Conversions

High-Tech Conversions to Showcase FREE-SAT Wipes at Productronica 2007

Industry News | 2007-11-08 22:02:38.0

EAST WINDSOR, CT � November 5, 2007 � High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that it will feature FREE-SAT presaturated wipes in Hall A4, Stand 420 at the upcoming at the upcoming Productronica 2007 exhibition and conference.

High-Tech Conversions

Engineered Conductive Materials Introduces Fast Cure Conductive Adhesive for Back Contact Solar Modules

Industry News | 2011-08-29 16:29:56.0

Engineered Conductive Materials debuts its DB-1580 Series Conductive Stringer Attach Adhesives for back contact applications in crystalline silicon solar modules.

Engineered Conductive Materials, LLC


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