Industry News: rdl (Page 1 of 1)

IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2017

Industry News | 2018-02-02 18:44:38.0

The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation. 

Surface Mount Technology Association (SMTA)

Pan Pacific Microelectronics Symposium Program Finalized

Industry News | 2019-12-11 16:04:23.0

SMTA announced that the program is finalized for the 25th Annual Pan Pacific Microelectronics Symposium. The event will take place February 10-13, 2020 at the Westin Hapuna Beach Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Surface Mount Technology Association (SMTA)

MacDermid Alpha to Exhibit and Present at TPCA and IMPACT

Industry News | 2021-12-13 12:52:59.0

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to be a Supporting Partner at the Upcoming IMAPS Device Packaging Conference

Industry News | 2021-03-31 17:56:27.0

MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Promote Latest Technology Offerings at the International Electronics Circuit Exhibition

Industry News | 2020-11-12 10:25:20.0

MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association.The show will be held from December 2-4, 2020 at the Shenzhen Convention and Exhibition Center,China.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Industry News | 2020-09-06 04:53:14.0

MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Industry News | 2020-09-10 11:09:50.0

MacDermid Alpha Electronics Solutions, a global leader in high performance semiconductor chemistries and assembly materials, will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Exhibitat TPCA and Present atIMPACT-EMAP 2020 Conference

Industry News | 2020-10-04 15:41:30.0

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.

MacDermid Alpha Electronics Solutions

Temporary Bonding Adhesive for Thin Wafer Handling

Industry News | 2016-08-17 09:26:56.0

AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.

AI Technology, Inc. (AIT)

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