Industry News: re balling (Page 1 of 9)

Intel Executive Keynotes 2013 IPC Electronic System Technologies Conference

Industry News | 2013-04-25 16:41:53.0

IPC Electronic System Technologies Conference (IPC ESTC), Tuesday, May 21, 2013, in Las Vegas.

Association Connecting Electronics Industries (IPC)

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Industry News | 2015-02-04 18:05:58.0

he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Surface Mount Technology Association (SMTA)

Donald Tyler, Corfin, to Present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip” at the SMTA Capital Chapter Meeting March 17th

Industry News | 2015-03-11 18:05:46.0

The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.

Surface Mount Technology Association (SMTA)

IPC And NPL Team Up To Solve Industry Process Issues With Free Defect Clinic At IPC APEX Expo 2011

Industry News | 2011-02-09 14:50:49.0

Manufacturing and quality engineers looking for solutions to process challenges will have an additional resource for answers with the new Process Defect Clinic at the IPC APEX EXPO conference and exhibition, April 12–14, 2011, in Las Vegas. Sponsored by IPC and the National Physical Laboratory (NPL), the free clinic will be held in booth 217 on the show floor to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.

Association Connecting Electronics Industries (IPC)

IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing

Industry News | 2012-05-23 14:18:26.0

Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing

Association Connecting Electronics Industries (IPC)

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK's NexJet NJ-8 System Simplifies Precision Fluid Dispensing for High-throughput Applications

Industry News | 2015-09-16 11:15:59.0

Nordson ASYMTEK introduces the NexJet® NJ-8 System which improves and simplifies the dispensing process for fast-paced production environments where precision, flexibility, and long-term reliability are important. The NJ-8's ReadiSet™ 2-piece jet cartridge is quickly and easily removed, cleaned, inspected, and re-installed without tools, maximizing equipment utilization and up-time. The NexJet system is an integral part of Nordson ASYMTEK's comprehensive closed-loop dispensing systems and fully-integrated software-control of the precision jet dispensing process.

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK Wins SMT China's Vision Award for its NexJet NJ-8 Jet Dispense Valve with the ReadiSet 2-piece Cartridge

Industry News | 2016-05-17 18:32:00.0

Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), was named the winner of SMT China's 2016 Vision Award in the dispensing category for its NexJet® NJ-8 with the ReadiSet™ jet cartridge. The Vision Awards recognizes companies for their remarkable achievements in China's electronics manufacturing industry. The Award was presented at NEPCON China, held April 26-28, 2016 in Shanghai, China.

ASYMTEK Products | Nordson Electronics Solutions

Nitrogen Protection Reflow Oven

Industry News | 2018-10-18 08:55:30.0

Nitrogen Protection Reflow Oven

Flason Electronic Co.,limited

Tech Symposium on SMT Micro Electronics Assembly and Rework

Industry News | 2015-08-05 10:32:21.0

SMT micro electronics assembly and rework symposium has been scheduled for 2015 for October 1, 2015. Learn/Re-learn how to perform a design of experiments, learn rework tips from Paul Wood and "lessons learned" from Chrys Shea.

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