Industry News | 2020-12-10 17:14:39.0
The following is a statement by John Mitchell, President and CEO of IPC, the global electronics manufacturing association, on today's vote by the U.S. House of Representatives to approve the final version of the Fiscal 2021 National Defense Authorization Act (NDAA):
Industry News | 2021-01-04 12:44:32.0
The following is a statement by Chris Mitchell, vice president of global government relations at IPC, the global electronics manufacturing association, on recent actions by the U.S. Government to bolster the security and resiliency of the U.S. defense electronics supply chain.
Industry News | 2021-03-06 03:08:24.0
In a letter to U.S. President Joe Biden, IPC applauds the Biden administration's early directions on manufacturing policy and maps a detailed policy agenda to drive growth and resilience in electronics manufacturing.
Industry News | 2016-06-27 14:54:49.0
In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2016-10-09 20:43:23.0
The SMTA Capital Chapter is pleased to announce its final meeting of 2016 will be on November 10th, from 5:00 pm to 7:00 pm at Zentech, 6980 Tudsbury Road, Baltimore, Maryland 21244. The focus of this chapter meeting will be “AXI and MXI; How They Complement Each Other” presented by John Travis, Nordson Dage.
Industry News | 2022-09-14 11:04:21.0
Virtual preliminary heats to start this October
Industry News | 2022-09-26 06:35:13.0
The electronics industry is calling on U.S. President Joe Biden to address urgent industrial base vulnerabilities and deliver on the promise of the CHIPS Act by prioritizing domestic development of printed circuit boards (PCBs) and integrated circuit (IC) substrates under Title III of the Defense Production Act.
Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
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