Industry News | 2011-01-18 13:20:51.0
Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.
Industry News | 2003-04-10 10:27:46.0
IPC and JEDEC Send Out Call for Papers
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
Industry News | 2010-10-18 14:10:04.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 5 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2022-12-20 06:08:25.0
I.C.T Engineer SMT technical ability is always online.
Industry News | 2008-12-15 16:20:40.0
Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.
Industry News | 2019-10-15 15:04:38.0
A new technical paper that focuses on the application requirements of printing small apertures and the results of a design of experiment testing will be presented at the upcoming Productronica trade fair in Germany. The paper will be presented by Edward Nauss, MPM Applications Engineer at ITW EAE.
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2012-10-16 18:56:39.0
IPC — Association Connecting Electronics Industries® will hold “IPC Conference on Solderability and Reliability for Electronics Assemblies” on 6-7 February 2013, in Budapest, Hungary.
Industry News | 2003-05-06 08:21:44.0
Will address key issues in the
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