Industry News: reduce self alignment (Page 8 of 40)

ACD Implements PhaseWare Event Tracking Software

Industry News | 2011-05-23 15:03:20.0

Automated Circuit Design (ACD) recently implemented PhaseWare Event Tracking Software at its facility in Richardson, TX. The PhaseWare Tracker™ product suite will enable ACD to serve, support, retain and maximize the value of every customer.

Automated Circuit Design (ACD)

BPM Microsystems Introduces Self-Teaching Automated Programming System

Industry News | 2018-12-03 09:48:43.0

BPM Microsystems, a leading global provider of device programming systems, announced another advance to off-line programming— the 4910. Rated at 1,708 Devices per Hour (DPH) on actual tray-to-tray jobs, the 4910 improves productivity by 43% compared to the prior model.

BPM Microsystems, Inc.

Use of Pressurex Pressure Indicating Sensor Film Increases Bond Strength and Reduces Defects in Ultrasonic Welding of Electronics

Industry News | 2010-02-19 09:45:37.0

Pressurex® Sensor Film Needed to Measure Contact Pressure In Ultrasonic Welding

Sensor Products Inc.

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech

AI-powered Solutions from Koh Young at SMTA International

Industry News | 2020-09-10 11:28:36.0

Artificial Intelligence (AI) is a buzzword often used with business and industrial technologies. Recently, it has demonstrated promising potential across a variety of industries – from self-driving cars to virtual doctors – all of which, though, have been limited exclusively for people. AI, however, has far-reaching applications within the manufacturing sector. By combing the right AI technologies, manufacturers can boost efficiency, improve flexibility, and even achieve self-optimizing processes. Printed circuit board assembly is no exception. Complementing the machine communication standards by industry associations, equipment providers like Koh Young are enabling the smart factory by adopting AI to generate "knowledge" from "experience."

Koh Young America, Inc.

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

ACD Announces Agreement with ExponentHR to Implement New HRIS Platform

Industry News | 2012-08-28 09:22:47.0

ACD,has signed an agreement with Exponent Technologies to implement the ExponentHR Human Resource Information System (HRIS) platform.

Automated Circuit Design (ACD)

Price Electronics Invests in the EVS 500 Solder Recovery System

Industry News | 2023-05-30 06:41:34.0

EVS International is pleased to announce that Price Electronics, headquartered in Winnipeg, Canada, has invested in a new EVS 500 Solder Recovery System.

EVS International

Dynatech Technology Adds Samsung Screen Printer SMP300 to Turnkey SMT Line

Industry News | 2007-06-11 10:27:17.0

Building on the successful SM Series of fast, flexible placement systems, Dynatech Technology has added the Samsung Screen Printer SMP300 System - used by Samsung worldwide to assembly consumer and industrial products - to expand its turnkey SMT capability for North American assemblers.

Hanwha Techwin CO., LTD.

Milara Receives Global Technology Award for Its Bumping System

Industry News | 2007-11-15 19:16:35.0

Medway, MA � November 15, 2007 � Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications, announces that it has been awarded a Global Technology Award in the category of Wafer-level Products for its innovative AWPb 300.

Milara Inc


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