Industry News: reduce voids (Page 2 of 21)

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Industry News | 2017-05-15 16:35:00.0

SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Two Indium Corporation Experts to Present “Best Papers” at SMTA South China Technology Conference 2018

Industry News | 2018-08-16 20:05:44.0

Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China.  Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.

Surface Mount Technology Association (SMTA)

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Industry News | 2016-02-06 01:03:23.0

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.

Indium Corporation

Indium Corporation’s Low-Voiding Solder Pastes Featured at IPC APEX 2016

Industry News | 2016-03-17 14:15:35.0

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.

Indium Corporation

KIC and Indium Corporation to Hold Voiding Clinic at APEX

Industry News | 2019-01-08 20:21:17.0

KIC and Indium Corporation will hold a voiding clinic in Booth #1215 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31 at the San Diego Convention Center.

KIC Thermal

Indium Corporation Features Void-Reducing Solder Paste Indium8.9HF at Productronica

Industry News | 2015-10-27 22:08:05.0

Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation

Christopher Associates/Koki Solder to Present Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes at SMTAI 2010

Industry News | 2010-09-29 23:32:58.0

Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

What is a vacuum reflow oven ? What is the difference between vacuum reflow welding and vacuum reflow welding?

Industry News | 2019-12-16 22:35:33.0

Vacuum reflow oven is to conduct high-quality welding for products in a vacuum environment to protect products and solder from being oxidized under the condition of vacuum, and to react the oxide of products and solder surface at the same time to improve the quality of welding surface and reduce the void rate of welding.

Beijing Technology Company


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