Industry News | 2022-11-29 07:25:57.0
As PCBAs become more complex to manufacture with miniaturised components and different parts being mounted to the board, the soldering process becomes more difficult with the risk of structural damage, voids and defects. To support its customers in the challenge Altus Group, partnered with ASSCON vapour phase soldering systems who have the most innovative solutions for the production process.
Industry News | 2015-04-21 16:57:06.0
The Balver Zinn Group announces that they will be attending SMT/Hybrid/Packaging 2015 scheduled to take place May 5-7 in Nuremberg, Germany. They will highlight the company’s latest solder flux and paste technology in Booth #7-308.
Industry News | 2018-03-27 20:45:48.0
Nihon Superior Co.is pleased to introduce its new SN100C logo. The logo replaces the originally used SN100C logo and will be used worldwide to brand this important alloy. The announcement was made during the recent IPC APEX EXPO in San Diego.
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2022-05-05 17:38:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will discuss solutions for voiding at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
Industry News | 2014-02-28 15:39:33.0
Seika Machinery, Inc.announces the release of the Eightech Vacuum Reflow RNV Series in North America.
Industry News | 2021-02-08 15:16:46.0
BTU International, Inc. will participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company will highlight the PYRAMAX™ Vacuum reflow oven during the virtual event.
Industry News | 2012-09-17 16:26:16.0
Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012
Industry News | 2019-01-17 20:29:01.0
KIC announces its partnership with iTAC Software AG, a leading Provider of MES premium solutions. The integration of smart Reflow Process Inspection (RPI) data analytics into the iTAC.MES.Suite ensures complete process control and traceability of the thermal process in the oven, previously referred to as the “black box” machine in the production line. This KIC-iTAC partnership creates new customer value for not only the reflow process, but for the entire production line, by providing process transparency, traceability, consistent quality and reduced costs through a new level of connectivity and automation. With the connection to KIC’s RPI data analytics iTAC now provides real-time insight into the reflow process to help factories run their production more effectively by reducing setup and changeover time, faster yield troubleshooting, and reduction in scrap and rework.
Industry News | 2016-07-18 17:00:38.0
KIC today announced plans to participate in the SMTA Carolinas Chapter Tech Session, scheduled to take place Thursday, August 18th in Greenville, SC. The event will be hosted by Hubbell Lighting, Inc. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”
