Industry News: reduction of solder paste usage (Page 1 of 4)

The Application of the Pin-in-Paste Reflow Process

Industry News | 2018-10-18 10:13:08.0

The Application of the Pin-in-Paste Reflow Process

Flason Electronic Co.,limited

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb

Recover up to 80% of pure solder with EVS – Learn more at SMTA Guadalajara

Industry News | 2018-10-15 18:59:13.0

EVS International, the leader in solder recovery, will exhibit with InterLatin on Stand 77 at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Nov. 14 - 15, 2018 at the Expo Guadalajara. EVS will show the EVS 500LF Solder Recovery System that can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross.

EVS International

EVS Launches Web Site to inform Industry of Significant Benefits of Solder Dross Recovery

Industry News | 2009-11-06 18:24:42.0

November 2009 - EVS International, the world leader in solder recovery systems, announces the launch of a new interactive Web site at www.solderrecovery.com aimed at explaining to the industry the enormous cost and environmental benefits from automating the solder dross recovery element of the wave soldering process.

EVS International

Advantages of ultrasonic spraying for photoresist

Industry News | 2020-11-18 02:11:55.0

Ultrasonic spraying technology is used for semiconductor photoresist coating. Compared with traditional coating processes such as spin coating and dip coating, it has the advantages of high uniformity, good encapsulation of microstructures, and controllable coating area.

HANGZHOU CHEERSONIC UlLTRASONICS EQUIPMENTS CO.,LIMITED

VisionMaster Masters 3-D SPI with the Introduction of the M500

Industry News | 2012-09-07 14:49:58.0

VisionMaster, Inc debuts the M500 Manual 3-D SPI system.

VisionMaster, Inc.

Seika Machinery Announces More Green Benefits of Its Solder Paste Recycling Unit

Industry News | 2010-06-04 17:48:10.0

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that with the implementation of its patent pending Solder Paste Recycling (SPR) unit, Seika is able to reduce the amount of waste material to less than 10 percent of current volumes by recycling solder paste.

Seika Machinery, Inc.

Christian Ott of SEHO Systems to Offer Void Reduction Tips at SMTA International

Industry News | 2012-09-17 15:38:30.0

SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Reduction of Voids in Solder Joints …

SEHO Systems GmbH

EVS Intl Launch Website to inform Industry on significant benefits of Solder Dross Recovery

Industry News | 2009-12-07 18:47:04.0

November, 2009 - EVS International, the world leader in solder recovery System’s, announces the launch of a brand new interactive website aimed at Explaining to the industry the enormous cost and environmental benefits from automating the solder dross recovery element of the wave soldering process.

EVS International

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