Industry News | 2017-02-05 10:18:08.0
The SMTA is pleased to announce its 2017 Educational Programming that includes conferences, webtorials and webinars, certification program and online training courses.
Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2024-07-26 03:15:33.0
From 2023 to 2024, one piece of equipment has seen a remarkable surge in sales within I.C.T's extensive product lineup: the Selective Solder Machine. This unexpected rise in popularity has left many wondering, why this particular machine? Today, we embark on a journey to uncover the story behind the Selective Solder Machine's success. We'll explore its innovative features, the benefits it brings to electronics manufacturing, and the reasons why it has become the go-to choice for industry leaders. Join us as we dive deep into the compelling narrative of why the Selective Solder Machine is taking the market by storm.
Industry News | 2015-04-09 19:50:17.0
Aqueous Technologies announces that its CEO Michael Konrad presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Konrad presented “Low Standoffs, High Densities, and High Reflow Technologies. The Challenges of Modern Day Cleaning.
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2018-04-25 20:16:44.0
KYZEN today announced that Mike Bixenman, DBA, will present at the SMTA Medical Electronics Symposium, scheduled to take place May 16-17, 2018 at the University of Texas at Dallas. In addition to the presentation, Jack Reinke, KYZEN cleaning expert, will be at table #8 during the Expo. Reinke will be available to meet with attendees to answer cleaning process questions.
Industry News | 2017-05-22 17:36:43.0
KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum. Bixenman will present the paper entitled, “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach” at 2:30 p.m. on Wednesday, June 7, 2017 at the Edward Village Markham in Ontario.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2023-06-26 09:18:15.0
BTU International, Inc. will exhibit its new Aurora reflow platform at NEPCON China. The show is scheduled to take place July 19-21, 2023 at the Shanghai World Expo Exhibition & Convention Center. The new Aurora 150N, 12-zone reflow oven will be on display in booth #1D38.
