Industry News: reflow no nitrogen (Page 10 of 27)

Cogiscan and Juki Provide VIP-VIRANT Group with Complete TTC Solution

Industry News | 2014-10-12 19:23:55.0

Cogiscan Inc. together with Juki, has provided VIP-VIRANT Group with a complete TTC solution for its new assembly line.

Cogiscan Inc.

Indium Corporation Features 'Power-Safe' NC-SMQ®75 Die-Attach Solder Paste at SEMICON China

Industry News | 2016-02-20 20:36:54.0

Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.

Indium Corporation

BTU to Show the PYRAMAX™ with ENERGY PILOT Software at SMT Hybrid Packaging

Industry News | 2015-04-06 16:37:35.0

BTU International will exhibit in Booth #7-421 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015, in Nuremberg, Germany. Company representatives will highlight the proven PYRAMAX™ and the award winning DYNAMO™ convection reflow ovens, both equipped with the new ENERGY PILOT software, designed to reduce the consumption of electrical power and process gas.

BTU International

Indium Corporation Experts to Present at IMAPS Device Packaging Virtual Conference

Industry News | 2021-03-30 11:44:23.0

Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.

Indium Corporation

BTU Picks Up Two Mexico Technology Awards

Industry News | 2018-11-16 16:35:37.0

BTU International announces that it was awarded two 2018 Mexico Technology Awards during the SMTA Guadalajara Expo & Tech Forum. The awards were presented to the company for its PYRAMAX™ Vacuum reflow oven and TrueFlat technology during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

BTU International

BTU's Vacuum Reflow Oven Wins 2021 Mexico Technology Award

Industry News | 2021-11-05 08:22:51.0

BTU International, Inc. is pleased to announce that it received a 2021 Mexico Technology Award in the category of Reflow Ovens for its PYRAMAX™ Vacuum Reflow Oven. The award was announced at a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

BTU International

BTU Accepts 5th Award for Vacuum Reflow Oven

Industry News | 2021-11-17 15:16:38.0

BTU International, Inc. is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Reflow Ovens for its PYRAMAX™ Vacuum Reflow Oven. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany. This is the fifth industry award that BTU has received for the PYRAMAX Vacuum.

BTU International

MacDermid Alpha Electronics Solutions Launches ALPHA WS-826 Robust Water Soluble Solder Paste

Industry News | 2021-10-07 15:45:29.0

MacDermid Alpha Electronics Solutions announces the release of ALPHA WS-826 water soluble solder paste, designed to provide excellent environmental stability even in extreme operating conditions.

MacDermid Alpha Electronics Solutions

SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions

Industry News | 2020-05-30 12:34:54.0

SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

Shenmao Technology Inc.

Cobar Receives �Honorable Mention� for IPC Technical Conference Paper to be presented at APEX Expo 2009

Industry News | 2009-03-27 09:54:10.0

Breda, Holland � March 2009 � Cobar BV, a member of the Balver Zinn Group, has been honored by the IPC's Technical Program Committee, in respect to a technical paper to be presented at the upcoming APEX Expo. The event will be held at the Mandalay Bay Resort and Convention Center, March 31 - April 2, 2009 in Las Vegas.

Cobar Solder Products Inc.


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