Industry News | 2016-06-15 20:20:37.0
The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge. Ljupce Talevski, from Aluwave AB took first place. In second place was Ekatarina Stahlmann from Grundig Business Syst. Coming in third place was Conny Hielscher from Grundig Business Syst.
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Industry News | 2018-12-08 03:20:37.0
Top Silicon Wafer Manufacturing Companies in the World
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2013-05-06 18:37:45.0
Kyzen will showcase the newest fast-drying stencil cleaner in Booth #G22 at NEPCON Malaysia 2013, from June 10-12, 2013 at the Penang International Sports Arena (PISA). Kyzen® E5615 addresses the market need for a stencil cleaner that dries quickly, using only airflow at ambient temperature and without staining.
Industry News | 2013-07-29 13:41:36.0
Kyzen will showcase its newest fast-drying stencil cleaner along with its semi-aqueous high-lead cleaner in Booth 2F10 at NEPCON South China, August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.
