Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
Industry News | 2010-07-16 14:59:02.0
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, was recognized with the IEEE’s Components, Packaging, and Manufacturing Technology Society (CPMT) Electronics Manufacturing Technology Award in acknowledgement of his contributions to electronics manufacturing technology.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2008-08-03 12:48:00.0
New Lead-free compatible, IR-based Unit Reworks all BGA components, including Plastic parts, PTH Sockets, SMD Connectors and Metal Shields
Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Industry News | 2019-04-01 19:37:06.0
Nordson MARCH announces the introduction of its FlexTRAK®-SHS automated plasma treatment system. The plasma system includes the 9.6-liter (585 in³) large-volume F3-S process chamber that can be configured for larger strips or can treat more strips per cycle, yielding higher throughput and increased productivity for semiconductor and electronics packaging.
Industry News | 2009-04-02 09:23:02.0
Economic woes � Chinese companies vie for increased sales
Industry News | 2009-04-10 00:26:25.0
OK International is preparing to take a wide range of innovative soldering and production assembly technologies to this year's Nepcon Shanghai being held over 21st � 24th April. On display at Booth 1D06, each system is designed to reduce training investment, perform a diverse array of applications and measurably increase productivity.
Industry News | 2020-09-10 11:16:53.0
Two Indium Corporation experts will present technical content during IMAPS International Symposium on Microelectronics, a global virtual event, Oct. 5-8.
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