Industry News: resist (Page 7 of 95)

Conflict Metals: Good Intentions Gone Tragically Bad

Industry News | 2011-05-23 15:41:12.0

It's a script straight out of the movies. Just replace "blood diamonds" with "blood metals" and begin with a scene that demonstrates the tens of millions of dollars in profit flowing into rebel mines in the Democratic Republic of the Congo (DRC), funding criminal networks and perpetrating horrific war crimes. In the movie, the U.S. government comes to the rescue by implementing a law that withholds resources from these groups, breaks the rebel mines and ends the atrocities.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to IPC and the Electronics Industry Seventy-Five Awards Presented at Fall Standards Development Committee Meetings

Industry News | 2016-09-29 20:30:17.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on September 26 at IPC's Fall Standards Development Committee Meetings in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.

Association Connecting Electronics Industries (IPC)

BEST Releases PCBVac(TM) -a Shop Vac for your PCB

Industry News | 2014-04-02 17:56:58.0

BEST Inc , Rolling Meadows IL, announced the release of a new shopvac like product for the PCB rework and repair area. Connected to shop air this product is able to suck up liquids and solids,

BEST Inc.

Printed Circuit Board Solder resist

Industry News | 2018-10-18 10:24:59.0

Printed Circuit Board Solder resist

Flason Electronic Co.,limited

Engineered Material Systems Introduces Linear Resistance Carbon Inks

Industry News | 2019-12-04 14:15:24.0

Engineered Material Systems, Inc. (EMS) is pleased to introduce CI-2069 Series carbon conductive inks for target resistance printing. CI-2069 Series inks feature excellent printability and stable resistance. The new ink series is offered in a suite of electrical resistance ranges.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces DF-3020 Dry Film Negative Photoresist

Industry News | 2015-01-06 17:08:54.0

Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and IC cooling applications, is pleased to introduce the DF-3020 dry-film negative photo resist for use in micro electro mechanical systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Permabond 820 High Temperature Resistant Instant Adhesive for Component Tacking

Industry News | 2010-02-17 21:16:19.0

SOMERSET, NJ ? Permabond 820 quick-setting, instant adhesive resists temperature ranges up to 200ºC (390ºF). Typical ethyl cyanoacrylates only resist temperatures to 82ºC (180ºF). Permabond 820 is a modified ethyl cyanoacrylate that has a fast fixture time and high-temperature resistance, making it an ideal choice when bonding components in position on dual-sided PCBs prior to wave soldering. Permabond 820 is colorless with a viscosity of 100cPs.

Permabond Engineering Adhesives

Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist

Industry News | 2015-06-17 14:45:34.0

Engineered Material Systems is pleased to introduce the DF-3005 Dry Film Negative Photo Resist for use in micro-electromechanical systems (MEMS) and wafer level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2016-09-08 13:30:10.0

Engineered Material Systems is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

Industry News | 2017-08-10 17:50:15.0

Engineered Material Systems is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.


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