Industry News | 2009-08-20 15:26:58.0
To progress development of its next-generation pre-applied underfill materials, LORD Corporation has selected DEK’s award-winning Galaxy platform. LORD, a Cary, North Carolina-based leading manufacturer of electronic materials, found the precision, accuracy and process capability of the Galaxy simply unmatched and, therefore, the ideal system to enable its materials innovation initiatives.
Industry News | 2010-04-23 19:25:06.0
World-renowned as the leading low-pressure molding solution, Henkel's popular Macromelt portfolio has now been extended to meet the requirements of Green and Portable Energy and Medical manufacturers.
Industry News | 2010-05-04 21:09:23.0
Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Industry News | 2010-09-07 12:12:54.0
Altium is returning to its home roots: the company is previewing the next release of its electronics design solution Altium Designer at ElectroneX, being held in Sydney tommorow.
Industry News | 2012-04-09 13:45:59.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.
Industry News | 2012-10-26 07:25:15.0
Sechan Electronics, Inc.relationship with Aegis Software extends back over 11 years, beginning with their initial purchase of CircuitCAM and CheckPoint; software modules that are now integrated into iLaunch.
Industry News | 2012-10-26 07:25:39.0
Sechan Electronics, Inc.relationship with Aegis Software extends back over 11 years, beginning with their initial purchase of CircuitCAM and CheckPoint; software modules that are now integrated into iLaunch.
Industry News | 2012-10-27 01:42:15.0
Sechan Electronics is an established contract manufacturing services company committed to developing, testing and manufacturing military electronics systems and subsystems for the Department of Defense and Prime Contractors. Sechan’s relationship with Aegis Software extends back over 11 years, beginning with their initial purchase of CircuitCAM and CheckPoint; software modules that are now integrated into iLaunch.
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