Industry News | 2008-04-08 23:55:52.0
SARASOTA, FL � April 2008 � Inovaxe Corp., a leader in delivering inventory control solutions to electronics manufacturers, announces that it has been awarded a SMT China Vision Award in the category of Assembly Tools for its INOCART-MSD, a true solution for managing moisture sensitive devices (MSD). The award was presented to the company during an April 8, 2008 ceremony that took place at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China.
Industry News | 2008-04-17 16:46:07.0
In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol� FF6000�, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress.
Industry News | 2009-08-20 15:26:58.0
To progress development of its next-generation pre-applied underfill materials, LORD Corporation has selected DEK’s award-winning Galaxy platform. LORD, a Cary, North Carolina-based leading manufacturer of electronic materials, found the precision, accuracy and process capability of the Galaxy simply unmatched and, therefore, the ideal system to enable its materials innovation initiatives.
Industry News | 2010-04-23 19:25:06.0
World-renowned as the leading low-pressure molding solution, Henkel's popular Macromelt portfolio has now been extended to meet the requirements of Green and Portable Energy and Medical manufacturers.
Industry News | 2010-05-04 21:09:23.0
Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Industry News | 2010-09-07 12:12:54.0
Altium is returning to its home roots: the company is previewing the next release of its electronics design solution Altium Designer at ElectroneX, being held in Sydney tommorow.
Industry News | 2012-04-09 13:45:59.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.
Industry News | 2012-10-26 07:25:15.0
Sechan Electronics, Inc.relationship with Aegis Software extends back over 11 years, beginning with their initial purchase of CircuitCAM and CheckPoint; software modules that are now integrated into iLaunch.
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