Industry News: reuse thrown out component (Page 1 of 1)

DEK launches Stinger; brand new low volume adhesive dispenser

Industry News | 2009-04-27 18:00:47.0

DEK has launched its brand new Stinger* technology, an integrated low volume adhesive dispense module enabling dual function capability from a single screen printing platform. Ideal for customers working with mixed technology boards for example, Stinger is an easy-to-use, flexible system featuring innovative patented technology to eliminate unnecessary stoppages and raise productivity.

ASM Assembly Systems (DEK)

Design Chain Associates Announces Availability of Standardized Part Numbering System

Industry News | 2003-06-19 15:55:13.0

Design Chain Associates, LLC, the leading Design Chain consulting firm, today announced the intent to issue an Internal Part Numbering (IPN) System Standard for use by PLM/PDM companies and their discrete manufacturing customers. The IPN standard is a simple, unintelligent numbering standard with major and optional minor levels of revision control intended to manage all the product-related needs of a manufacturing company.

Design Chain Associates, LLC

Advanced Assembly Celebrates Earth Day with Ongoing Commitment to Support Environmental Initiatives

Industry News | 2021-04-21 14:25:12.0

Advanced Assembly today reaffirmed its ongoing commitment to support and implement environmentally responsible programs and processes. The company is focused on eliminating waste, improving energy efficiency, and recycling all possible materials within each department.

Advanced Assembly, LLC.

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:56:07.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

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