Industry News | 2019-01-12 07:42:28.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Industry News | 2010-09-26 16:12:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.
Industry News | 2008-05-23 18:09:23.0
LOS ALAMITOS, CA � May 20, 2008 � Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor� middle stacked package that makes a Triple Stack PoP package (PSvfBGA).
Industry News | 2013-09-16 14:38:01.0
VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.
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