Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2010-09-26 16:12:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.
Industry News | 2013-06-18 06:59:26.0
StarChip®, today announced that it is currently sampling the SCF136H product, its latest SIM controller designed to serve the Native market. The addition of the SCF136H to its product portfolio makes StarChip a broad range supplier of SIM controllers delivering solutions for the whole Telecom market.
Industry News | 2019-05-31 08:50:57.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Industry News | 2019-05-31 08:56:07.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Industry News | 2008-05-23 18:09:23.0
LOS ALAMITOS, CA � May 20, 2008 � Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor� middle stacked package that makes a Triple Stack PoP package (PSvfBGA).
Industry News | 2012-11-06 15:19:48.0
Mentor Graphics announced its new Tessent® IJTAG solution, which allows designers to easily reuse test, monitoring and debugging logic embedded in existing IP blocks. Supporting the IEEE P1687 (IJTAG) standard, the solution automatically retargets test and debug commands and generates an integrated hierarchical control and data network with a single top-level interface for an entire SoC.
Industry News | 2008-05-15 23:05:35.0
RICHARDSON, Texas (May 14, 2008) - Responding to the increasing momentum in the electronics industry toward embedded instrumentation, ASSETR InterTech, Inc. (www.asset-intertech.com) announced it is positioning the company, its products and its technologies to provide open tools for embedded instrumentation in design validation, test and debug applications.
Industry News | 2019-09-30 09:47:03.0
Plastic Optical Fiber Backbone Complements Wi-Fi Mesh for Guaranteed Gigabit Performance
Industry News | 2024-06-24 09:27:29.0
Heraeus Electronics is proud to announce its participation in the FastLane project, an ambitious EU-funded initiative aimed at revolutionizing the European value chain for Silicon Carbide (SiC)-based power electronics. This project, led by Valeo France, spans 36 months, from May 1, 2024, to April 30, 2027.
