Industry News | 2024-04-15 10:54:59.0
IPC J-STD-001 and IPC-A-610 cover printed board assembly process controls, materials, and post-assembly acceptance criteria for the electronics industry
Industry News | 2003-04-10 08:02:51.0
Rev 2000 takes a process view of the ISO standard
Industry News | 2012-04-03 13:02:23.0
BANNOCKBURN, Ill., USA, April 3, 2012 — IPC — Association Connecting Electronics Industries® announced the Japanese language release of the E revision of IPC-A-610, 電子組立品の許容基準. IPC’s most widely-used standard.
Industry News | 2015-06-18 17:23:06.0
IPC Association Connecting Electronics Industries® has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever evolving standard provides common language of terms and definitions for the electronics industry.
Industry News | 2010-04-10 02:16:34.0
IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2010-06-21 15:29:58.0
BANNOCKBURN, IL — Environmental regulations on chemicals and substances continue to grow worldwide, often driven by political pressures. While some focus on manufacturing wastes, such as air and wastewater emissions, there is a growing lexicon of regulations which focus on the chemicals contained in products. To help companies understand new laws, regulations and regulatory trends, IPC will hold an IPC Symposium on Electronics and the Environment on July 19–21, 2010, in Boston, Mass.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2015-08-20 13:42:15.0
IPC — Association Connecting Electronics Industries® has released IPC-4101D-WAM1, an amendment to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.
Industry News | 2010-06-11 15:59:00.0
BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.
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