Industry News: reworkable edgebond adhesive (Page 4 of 17)

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

Customized Circuit Frames for PCB Repair

Industry News | 2009-10-17 09:43:47.0

Reduce PCB Repair Costs

BEST Inc.

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc

MacDermid Alpha Electronics Solutions to Feature ALPHA HiTech Portfolioat SMTA Empire Expo & Tech Forum

Industry News | 2021-09-17 04:23:02.0

The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Empire Expo & Tech Forum on Tuesday, September 28that the RIT Inn & Conference Center in Henrietta, New York.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Electronics Solutions to Present Paper on Low Voiding Solutions at SMTA Juarez

Industry News | 2022-05-05 17:38:12.0

The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will discuss solutions for voiding at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Presents Technical Paper at SMTA Penang Chapter

Industry News | 2022-09-15 06:27:38.0

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

MacDermid Alpha's Kester Brand Announces Partnership with Proactive Process Solutions Group, LLC

Industry News | 2021-12-21 14:42:52.0

The Kester brand of MacDermid Alpha Electronics Solutions is proud to announce a partnership with Proactive Process Solutions Group, LLC.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Electronics Solutions to Feature Solder Joint Ruggedization Solutions at SMTA Rocky Mountain Expo & Tech Forum and SMTA Dallas Expo & Tech Forum

Industry News | 2022-03-03 16:02:24.0

The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Electronics Solutions to Feature Solder Joint Ruggedization Solutions at SMTA Rocky Mountain Expo & Tech Forum and SMTA Dallas Expo & Tech Forum

Industry News | 2022-03-09 12:21:01.0

The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.

MacDermid Alpha Electronics Solutions


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